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	<title>Double Check Thermal Solutions</title>
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		<title>COLD PLATE TECHNOLOGY</title>
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		<description><![CDATA[The Need Trends towards higher speed, higher power consumption and denser packaging of electronic components, have generated a need for effective Thermal Management solutions. The reliable performance of the component and its long life are directly related to effectively controlling &#8230; <a href="http://dc-ts.com/?p=289">Continue reading <span class="meta-nav">&#8594;</span></a>]]></description>
			<content:encoded><![CDATA[<p><strong>The Need </strong></p>
<p>Trends towards higher speed, higher power consumption and denser packaging of electronic components, have generated a need for effective Thermal Management solutions. The reliable performance of the component and its long life are directly related to effectively controlling its junction temperature below specific limits.</p>
<p>In some applications, mainly in Telecommunication, computer equipment and Power Electronics, the heat dissipation of the electronic component reaches such high levels, that conventional air cooling is insufficient, due to the low heat capacity of the air. Moreover, very high air flow sources are bulky, expensive, and generate a very high noise level.</p>
<p>The Solution &#8211; Cold Plates Liquid cooling offers higher heat capacity than any air-based methods. It is, therefore, the best way to solve cooling problems of powerful electronic equipment. The superior thermal performance of liquid cooling is based on the high heat capacity and good thermal conductivity of the coolant. A typical cooling system includes Cold Plates, tubing, pumps and temperature control equipment.</p>
<p><strong>Cold Plate Advantages</strong></p>
<p>High cooling capacity.</p>
<p>Low noise generation.</p>
<p>Possibility of locating pump and temperature control equipment outside the electronic device that needs to be cooled, thereby freeing space inside the cabinet or system.</p>
<p>Double Check&#8217;s capabilities</p>
<p>Double Check has the engineering and technological capabilities to design, analyze and produce different types of liquid Cold Plates, including Plate &amp; Tube Cold Plates and Liquid Channel Cold Plates.</p>
<p>The Plate &amp; Tube Cold Plate consists of a base plate made of a metal with high thermal conductivity (usually copper or aluminum), and copper tubing inserted into the plate&#8217;s channels Depending on the plate&#8217;s material, different bonding techniques are utilized to connect between the tube and the plate.</p>
<p>The Liquid Channel Cold Plate consists of two copper or aluminum pieces with internal coolant passages, produced by milling or by brazing of special fins stock. The two pieces are brazed together to form a sealed liquid Cold Plate.</p>
<p>Double Check incorporates the following steps into design phase:</p>
<p>Thermal analysis of the specific thermal problem &#8211; definition of the output parameters and structure of the required cold plate. The optimal selection of a Cold Plate type takes into consideration the specific thermal requirements, features of the device that needs to be cooled, weight and cost limitations.</p>
<p>Plate &amp; Tube Cold Plates are suitable for cooling of devices with a middle level of power dissipation. Their thermal performance is somehow limited due to additional thermal contact between the tube and the plate. Another reason is the relatively low heat exchange efficiency of liquid tern$ flow inside a tube. Liquid Channel Cold Plates have a higher thermal performance due to a much more efficient heat exchange inside the milled channels, thanks CO to fins stock with a very dense structure. Moreover, the direct contact between the coolant and the base plate results in a lower system&#8217;s thermal resistance. On the other hand, Liquid Channel Cold Plates are more expensive. Appropriate selection of the working liquid, pump, tubing and it temperature control equipment &#8211; the working liquid is chosen, while to taking into consideration the temperature range of the system operation and the corrosion resistance of the Cold Plate&#8217;s materials. Possible of coolants are water, ethylene or propylene glycol or their mixture with water.</p>
<p>The pump provides liquid flow through the Cold Plate against the total system&#8217;s hydraulic resistance, including Cold Plate&#8217;s channels, input and of the output fittings, tubing and temperature control equipment. The selected won pump&#8217;s material should be compatible to the working liquid and the temperature range. The Temperature control equipment maintains the required temperature of the liquid and rejects the dissipated power from the liquid cooling system to the ambient air. The temperature control equipment may be either passive or active. Passive &#8211; regular liquid-to-air heat exchanger which maintains the liquid&#8217;s temperature on or up to the ambient temperature level. Active &#8211; liquid chiller allowing to reduce the liquids temperature below the ambient temperature level.</p>
<p><strong>Complete Custom-Made Solutions </strong></p>
<p>Continuous innovations in the Power Electronic Packaging industry demand equally continuous improvements in Thermal Management. The design time cycles are decreasing in view of the competitive marketplace. Moreover, modern thermal demands may require the combination of one or more cooling technologies. Double Check has I it all! Its strong multi-disciplinary engineering skills enable Double Check to offer complete, reliable, cost-effective and highly efficient solutions n for various applications. Double Check specializes in design and production of a range of Thermal Management products, among which are: Heat Sinks, Cold Plates, Thermoelectric Systems, Heat Pipes, and our new Patent-Pending PCHS (Porous Core Heat Sink). Double Check is prepared to apply any Thermal Management discipline to meet your requirements.</p>
<p><strong>Liquid Cold Plates Selection Chart</strong></p>
<table border="1" cellspacing="0" cellpadding="0">
<tbody>
<tr>
<td valign="top" width="114"><strong>Type </strong></td>
<td valign="top" width="114"><strong>Base Plate </strong></td>
<td valign="top" width="114"><strong>Tubing/ Fins</strong></td>
<td valign="top" width="114"><strong>Power dissipation density</strong></td>
<td valign="top" width="114"><strong>Features</strong></td>
</tr>
<tr>
<td valign="top" width="114"><strong>Plate &amp; Tube </strong></td>
<td valign="top" width="114"><strong>Aluminum/Copper</strong></td>
<td valign="top" width="114"><strong>Copper </strong></td>
<td valign="top" width="114"><strong>15 W/cm^2 </strong></td>
<td valign="top" width="114"><strong> </strong></td>
</tr>
<tr>
<td valign="top" width="114"><strong>Liquid Channel </strong></td>
<td valign="top" width="114"><strong>Aluminum </strong></td>
<td valign="top" width="114"><strong>Aluminum brazed fins or milled channels </strong></td>
<td valign="top" width="114"><strong>20 W/cm^2</strong></td>
<td valign="top" width="114"><strong> </strong></td>
</tr>
<tr>
<td valign="top" width="114"><strong> </strong></td>
<td valign="top" width="114"><strong>Copper</strong></td>
<td valign="top" width="114"><strong>Copper brazed or soldered fins, or milled channels </strong></td>
<td valign="top" width="114"><strong> </strong></td>
<td valign="top" width="114"><strong> </strong></td>
</tr>
</tbody>
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